Industry Guidelines
Veiwable as PDFsNIGP 101.01: Guidelines for Commercial Semiconductor Packaging and Labeling Superseded by JEP 130 NIGP 102: Guidelines for Unit Packing for Integrated Circuits - Tubes (Rails) Superseded By JEP 130 NIGP 103: Guidelines for Identification and Labeling of Moisture Sensitive Integrated Circuits Superseded by JEP 113-XX NIGP 104: Guidelines for the Packing and Handling of Moisture Sensitive Integrated Circuits Superseded by JEP 124 NIGP 105: Handling Guidelines for Moisture Sensitive Plastic Surface Mount Components Superseded by JEP 124 NIGP 106b: Handling Guidelines for the Transference of Tray-Packaged ICs NIGP 107: Guidelines for the Format of Military Certificates of Conformance NIGP 108: Guidelines for Packing & Dunnage of Electronic Components NIGP 109: Guidelines for Distributor Assessment of Manufacturer Performance NIGP 110: Technical Guidelines for Electronic Price/Sales Catalog NIGP 111: Guidelines for the Format of Packing Slips NIGP 112: NEDA Guidelines for Auto Identification (1-Dimensional Bar Code & 2-Dimensional Matrix Code for Suppliers Product Package & Shipment Labeling) NIGP 113: NEDA Guidelines for Product Returns |